Sell WINBOND W55F10B New Stock

#W55F10B WINBOND W55F10B New Flash, 1MX1, PDIP8, DIP-8, W55F10B pictures, W55F10B price, #W55F10B supplier


Manufacturer Part Number: W55F10B
Pbfree Code: No
Part Life Cycle Code: Obsolete
Part Package Code: DIP
Package Description: DIP-8
Pin Count: 8
ECCN Code: EAR99
HTS Code: 8542.32.00.51
Manufacturer: Winbond Electronics Corp
Risk Rank: 5.88
Clock Frequency-Max (fCLK): 1 MHz
Data Retention Time-Min: 10
Endurance: 100000 Write/Erase Cycles
JESD-30 Code: R-PDIP-T8
JESD-609 Code: e0
Memory Density: 1048576 bit
Memory IC Type: FLASH
Memory Width: 1
Number of Functions: 1
Number of Terminals: 8
Number of Words: 1048576 words
Number of Words Code: 1000000
Operating Mode: SYNCHRONOUS
Operating Temperature-Max: 70 °C
Organization: 1MX1
Package Body Material: PLASTIC/EPOXY
Package Code: DIP
Package Equivalence Code: DIP8(UNSPEC)
Package Shape: RECTANGULAR
Package Style: IN-LINE
Parallel/Serial: SERIAL
Peak Reflow Temperature (Cel): NOT SPECIFIED
Power Supplies: 5 V
Programming Voltage: 5 V
Qualification Status: Not Qualified
Standby Current-Max: 0.000004 A
Subcategory: Flash Memories
Supply Current-Max: 0.01 mA
Supply Voltage-Max (Vsup): 5.5 V
Supply Voltage-Min (Vsup): 2.4 V
Supply Voltage-Nom (Vsup): 4.5 V
Surface Mount: NO
Technology: CMOS
Temperature Grade: COMMERCIAL
Terminal Finish: Tin/Lead (Sn/Pb)
Terminal Form: THROUGH-HOLE
Terminal Position: DUAL
Flash, 1MX1, PDIP8, DIP-8

Shunlongwei Inspected Every W55F10B Before Ship, All W55F10B with 6 months warranty.

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