Sell SAMSUNG K524G2GACB-A050 New Stock

#K524G2GACB-A050 SAMSUNG K524G2GACB-A050 New DDR DRAM, 64MX16, 5.5ns, CMOS, PBGA137, 10.5 X 13 MM, 1.2 MM HEIGHT, 0.80 MM PITCH, FBGA-137, K524G2GACB-A050 pictures, K524G2GACB-A050 price, #K524G2GACB-A050 supplier
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Manufacturer Part Number: K524G2GACB-A050
Rohs Code: Yes
Part Life Cycle Code: Obsolete
Ihs Manufacturer: SAMSUNG SEMICONDUCTOR INC
Part Package Code: BGA
Package Description: TFBGA, BGA137,10X15,32
Pin Count: 137
ECCN Code: EAR99
HTS Code: 8542.32.00.32
Manufacturer: Samsung Semiconductor
Risk Rank: 5.82
Access Mode: MULTI BANK PAGE BURST
Access Time-Max: 5.5 ns
Additional Feature: AUTO/SELF REFRESH
JESD-30 Code: R-PBGA-B137
JESD-609 Code: e1
Length: 13 mm
Memory Density: 1073741824 bit
Memory IC Type: DDR DRAM
Memory Width: 16
Mixed Memory Type: FLASH+SDRAM
Number of Functions: 1
Number of Ports: 1
Number of Terminals: 137
Number of Words: 67108864 words
Number of Words Code: 64000000
Operating Mode: SYNCHRONOUS
Operating Temperature-Max: 85 °C
Operating Temperature-Min: -25 °C
Organization: 64MX16
Package Body Material: PLASTIC/EPOXY
Package Code: TFBGA
Package Equivalence Code: BGA137,10X15,32
Package Shape: RECTANGULAR
Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH
Power Supplies: 1.8 V
Qualification Status: Not Qualified
Seated Height-Max: 1.2 mm
Standby Current-Max: 0.002 A
Subcategory: Other Memory ICs
Supply Current-Max: 0.025 mA
Supply Voltage-Max (Vsup): 1.95 V
Supply Voltage-Min (Vsup): 1.7 V
Supply Voltage-Nom (Vsup): 1.8 V
Surface Mount: YES
Technology: CMOS
Temperature Grade: OTHER
Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form: BALL
Terminal Pitch: 0.8 mm
Terminal Position: BOTTOM
Width: 10.5 mm
DDR DRAM, 64MX16, 5.5ns, CMOS, PBGA137, 10.5 X 13 MM, 1.2 MM HEIGHT, 0.80 MM PITCH, FBGA-137

Shunlongwei Inspected Every K524G2GACB-A050 Before Ship, All K524G2GACB-A050 with 6 months warranty.

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